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Resultaten visas 1 - 10 / 1896
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Publicationer information ikon
On the Formation of the
Intermetallic
Compounds
in the Sn-Cu-Ni-system
Referentgranskad
Vuorinen, V.; Kivilahti, J.
Helsinki University of Technology
1997
Publicationer information ikon
Formation of the
Intermetallic
Compounds
between liquid Sn and Different Cu-Ni Metalization
Vuorinen, V.; Korhonen, T-M.; Kivilahti, J.K.
-
2001
Publicationer information ikon
Formation of
Intermetallic
Compounds
Between Liquid Sn and Various CuNix Metallizations
Referentgranskad
DOI
10.1007/s11664-008-0411-x
Vuorinen, Vesa; Yu, Hao; Laurila, Tomi; Kivilahti, Jorma
Journal of Electronic Materials
2008
Publicationer information ikon
Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn-Cu
intermetallic
compound layers
Referentgranskad
DOI
10.1016/j.microrel.2008.08.007
Laurila, Tomi; Hurtig, Johannes; Vuorinen, Vesa; Kivilahti, Jorma
Microelectronics Reliability
2009
Publicationer information ikon
Impact of
Intermetallic
Compounds
on Drop Reliability of High-density Assemblies
Referentgranskad
Mattila, Toni; Kivilahti, Jorma
-
2006
Publicationer information ikon
Gradient-level and nonlocal density functional descriptions of Cu-Au
intermetallic
compounds
Referentgranskad
Öppen tillgång
DOI
10.1140/epjb/o2018-90166-9
Henrik Levämäki, Liyun Tian, Kalevi Kokko, Levente Vitos
European Physical Journal B: Condensed Matter and Complex Systems
2018
Publicationer information ikon
Formation of
Intermetallic
Compounds
in Solder Joints and Its Effects on Joint Reliability
Zeng, K.; Peng, W.; Kivilahti, J.
-
2000
Publicationer information ikon
Intermetallic
Void Formation in Cu-Sn Micro-Connects
Öppen tillgång
Ross, Glenn
Aalto University
2019
Publicationer information ikon
Effect of Dissolution and
Intermetallic
Formation on the Reliability of FC Joints
Referentgranskad
Kulojärvi, K.; Vuorinen, V.; Kivilahti, J.K.
Microelectronics International
1998
Publicationer information ikon
Void formation and its impact on Cu-Sn
intermetallic
compound formation
Referentgranskad
DOI
10.1016/j.jallcom.2016.03.193
Ross, Glenn; Vuorinen, Vesa; Paulasto-Kröckel, Mervi
Journal of Alloys and
Compounds
2016
On the Formation of the
Intermetallic
Compounds
in the Sn-Cu-Ni-system
Referentgranskad
1997
Formation of the
Intermetallic
Compounds
between liquid Sn and Different Cu-Ni Metalization
2001
Formation of
Intermetallic
Compounds
Between Liquid Sn and Various CuNix Metallizations
Referentgranskad
DOI
10.1007/s11664-008-0411-x
2008
Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn-Cu
intermetallic
compound layers
Referentgranskad
DOI
10.1016/j.microrel.2008.08.007
2009
Impact of
Intermetallic
Compounds
on Drop Reliability of High-density Assemblies
Referentgranskad
2006
Gradient-level and nonlocal density functional descriptions of Cu-Au
intermetallic
compounds
Referentgranskad
Öppen tillgång
DOI
10.1140/epjb/o2018-90166-9
2018
Formation of
Intermetallic
Compounds
in Solder Joints and Its Effects on Joint Reliability
2000
Intermetallic
Void Formation in Cu-Sn Micro-Connects
Öppen tillgång
2019
Effect of Dissolution and
Intermetallic
Formation on the Reliability of FC Joints
Referentgranskad
1998
Void formation and its impact on Cu-Sn
intermetallic
compound formation
Referentgranskad
DOI
10.1016/j.jallcom.2016.03.193
2016
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